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SUM110P06-08L
Vishay Siliconix
THERMAL RATINGS
200
150
100
1000
100
10
Limited b y r DS(on)*
10 μ s
100 μ s
1 ms
Package Limited
10 ms
100 ms, DC
50
0
1
0.1
T C = 25 °C
Single P u lse
0
25
50
75
100
125
150
175
0.1
1
10
100
2
1
T C ? Case Temperat u re (°C)
Maximum Avalanche and Drain Current
vs. Case Temperature
D u ty Cycle = 0.5
* V GS
V DS ? Drain-to-So u rce V oltage ( V )
minim u m V GS at w hich r DS(on) is specified
Safe Operating Area
0.2
N otes:
0.1
P DM
t 1
0.1
0.05
0.02
Single P u lse
t 1
t 2
1. D u ty Cycle, D =
t 2
2. Per Unit Base = R thJA = 62.5 °C/ W
3. T JM ? T A = P DM Z thJA(t)
4. S u rface Mo u nted
0.01
10 -4
10 -3
10 -2
10 -1
1
S qu are W a v e P u lse D u ration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73045.
Document Number: 73045
S-80273-Rev. B, 11-Feb-08
www.vishay.com
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